You are here: Home » Blogs » Industry Information » What is Copper Clad Laminate (CCL)?

What is Copper Clad Laminate (CCL)?

Views: 0     Author: Site Editor     Publish Time: 2021-05-17      Origin: Site

Inquire

facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
sharethis sharing button
What is Copper Clad Laminate (CCL)?

Copper-clad laminate (CCL) is a substrate coated with copper foil on one or both sides. It is commonly made by laminating materials such as fiberglass cloth, paper, or plastic with copper foil. In printed circuit sheet (PCB) manufacturing, CCL is essential for creating circuit connections while providing electrical and mechanical support. The thickness and quality of the copper foil can be customized to suit specific application requirements.

Aluminum-or-metal-core-board-or-insulated-metal-substrate--ezgif.com-webp-to-jpg-converter

>> Key Differences Between CCL and PCB

While CCL and PCB are closely related, they serve different purposes:

  • Copper Clad Laminate (CCL): A base material with copper foil used as the foundation for creating PCBs.

  • Printed Circuit Sheet (PCB): A composite material made by pressing multiple layers of CCL and insulation materials. PCBs are used for multi-layer circuits and higher circuit density.


>> Commonly Used CCL Materials

FR-2-phenolic-paper-or-phenolic-cotton-paper-ezgif.com-webp-to-jpg-converter

Phenolic Paper (XX/XXX)

  • Properties: Made of paper impregnated with phenolic resin.

  • Applications: Used in single-sided consumer electronics.

  • Limitations: Inferior electrical properties, low arc resistance, and rated to 105°C.

FR-4-a-woven-fiberglass-cloth-impregnated-with-an-epoxy-resin-ezgif.com-webp-to-jpg-converter

Woven Fiberglass Cloth (FR-4)

  • Properties: Low water absorption, excellent insulation, and arc resistance.

  • Applications: Common in various electronics.

  • Grades: Available in several grades, typically rated to 130°C.

Insulated Metal Substrate (IMS)

  • Properties: Aluminum or metal core clad with thermally conductive thin dielectric layers.

  • Applications: Power switches, LEDs, and components requiring significant cooling.

  • Thickness Options: Commonly 0.8mm to 3mm.

Flexible Substrates

  • Kapton/UPILEX: Polyimide foils used in flexible circuits.

  • Pyralux: Polyimide-fluoropolymer composite foil.


>> Other Materials and Applications

Flame Retardant Series (FR)

  • FR-1: Similar to cardboard, rated to 105°C, with low moisture resistance.

  • FR-3: Cotton paper impregnated with epoxy.

  • FR-4: The most common grade with versatile applications.

  • FR-5: High strength at elevated temperatures, rated to 170°C.

Glass Fiber Reinforced Epoxy

  • G-10: Offers high insulation resistance and low moisture absorption.

  • G-11: Retains strength at high temperatures and resists solvents.

Composite Epoxy Material (CEM)

  • CEM-1 to CEM-5: Varying combinations of cotton paper, woven glass, and epoxy for different applications.

Polytetrafluoroethylene (PTFE)

  • Standard PTFE: High-frequency applications, low dielectric loss.

  • Ceramic-Filled PTFE: Adjustable dielectric properties for specialized uses.

Alumina

  • Properties: Ceramic material with high thermal conductivity and mechanical performance.

  • Applications: High-performance electronics.


>> Choosing the Right Copper Clad Laminate

When selecting a CCL, consider factors such as application requirements, electrical properties, thermal performance, and thickness. The right choice ensures optimal functionality and durability in your PCB designs.

For further assistance in selecting or sourcing copper-clad laminates, please contact Fenhar Insulation Material Manufacturers, experts in PCB materials.

Subscribe to our newsletter
Promotions, new products and sales. Directly to your inbox.

Quick Link

Product Category

Contact Us
 No.188 Fengwang Industry Zone, Liuji Town, Tongshan District, Xuzhou, China
  info@fenharxz.com
 +86-516-85280035
  +86-18952117287
 
Copyright © 2024 Fenhar New Material CO., LTD. All Rights Reserved.
Sitemap
We use cookies to enable all functionalities for best performance during your visit and to improve our services by giving us some insight into how the website is being used. Continued use of our website without having changed your browser settings confirms your acceptance of these cookies. For details please see our privacy policy.
×