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Copper Clad Laminate (CCL) PCB Base Material

Fenhar Copper Clad Laminate (CCL) combines an insulating base material with bonded copper foil to provide a reliable foundation for printed circuit board fabrication. Available in customized thicknesses, copper weights and material grades for diverse electronic manufacturing requirements.
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Product Details

Copper Clad Laminate (CCL)
Fenhar Copper Clad Laminate is engineered for circuit board production where electrical insulation, mechanical integrity and dependable copper adhesion are essential. Depending on the required performance, the laminate can be supplied with an epoxy-glass FR-4 base or other suitable substrate systems. Single-sided and double-sided copper cladding options support different circuit layouts, from straightforward control boards to more demanding electronic assemblies. Customers can specify laminate dimensions, overall thickness, copper foil weight and thermal requirements to match their fabrication processes. Material selection can also take account of soldering temperatures, moisture exposure, drilling conditions and dimensional stability, helping PCB manufacturers choose a suitable substrate for their intended operating environment.

Product Parameters

Base Material
FR-4 epoxy ,resin ,reinforced ,with ,woven ,glass ,fabric; ,other ,grades ,available ,on ,request
Laminate Thickness
Approximately 0.10–3.20 ,mm, ,depending ,on ,grade ,and ,availability
Copper Foil Thickness
12, 18, ,35, ,70 ,and ,105 ,μm ,nominal ,options
Copper Cladding
Single-sided or ,double-sided
Glass Transition Temperature (Tg)
Grade-dependent; approximately ,130–180°C ,for ,selected ,FR-4 ,v0 grade
Panel Dimensions
Standard or ,customized ,sizes, ,subject ,to ,material ,grade ,and ,production ,capability

Product Advantages

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Reliable Copper-to-Substrate Bonding

Properly manufactured laminates provide copper adhesion suited to subsequent imaging, etching and circuit pattern formation, helping maintain conductor integrity during PCB fabrication.

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Compatible with Established PCB Processes

Suitable grades can be processed using conventional PCB methods, including drilling, copper pattern etching and multilayer board fabrication where the selected material system permits.

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Flexible Material and Size Selection

Different substrate grades, copper weights and sheet dimensions allow manufacturers to select materials according to board design, fabrication requirements and production volume.


Product Applications

FAQ

  • What is the minimum order quantity?
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    The minimum order quantity depends on the specific product you are interested in. For detailed information, please contact us directly via email or WhatsApp.
  • What is the price of this product?
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    The price of our products varies depending on the quantity, size, and specifications. For an accurate quote, please reach out to us via email or WhatsApp, and we'll provide you with the best options tailored to your needs.
  • What is the average delivery time?
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    Delivery times vary based on the quantity and specifications of the order. Typically, delivery can take anywhere from 3 to 30 days. For more precise information, please contact us directly via email or WhatsApp.
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 No.188 Fengwang Industry Zone, Liuji Town, Tongshan District, Xuzhou, China
  info@fenharxz.com
 +86-516-85280035
  +86-18952117287
 
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