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Product Details
Product Parameters
Product Advantages
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Reliable Copper-to-Substrate Bonding
Properly manufactured laminates provide copper adhesion suited to subsequent imaging, etching and circuit pattern formation, helping maintain conductor integrity during PCB fabrication.
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Compatible with Established PCB Processes
Suitable grades can be processed using conventional PCB methods, including drilling, copper pattern etching and multilayer board fabrication where the selected material system permits.
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Flexible Material and Size Selection
Different substrate grades, copper weights and sheet dimensions allow manufacturers to select materials according to board design, fabrication requirements and production volume.
Product Applications
FAQ