Views: 0 Author: Site Editor Publish Time: 2025-08-26 Origin: Site
Fenhar Material introduces a purpose-built sheet for PCB solder pallets and carriers: a woven glass-fiber reinforced epoxy laminate with tunable surface resistivity for antistatic performance. Designed around the realities of modern lead-free production, the product prioritizes dimensional stability under repeated thermal cycling, resistance to aggressive flux chemistries, and the ability to be CNC-machined into board-matched pallets with very fine features. This board is intended as a high-performance alternative to established grades such as Röchling’s Durostone® and Ricocel®-type materials.
Wave-solder pallets must hold assemblies precisely while surviving thousands of molten-solder exposures, chemical attack from flux, and frequent handling. Fenhar’s new sheet combines a tightly woven glass reinforcement and a high-temperature epoxy matrix to limit flux penetration, minimize dimensional drift, and preserve fine pocket geometries over long service life. Built-in antistatic surface characteristics reduce reliance on temporary coatings or tapes during AOI and pick-and-place operations, while the low thermal conductivity helps protect sensitive components from excessive heat soak during selective or full-board processes.
Sustained high-temperature capability: engineered to tolerate continuous elevated process temperatures typical of modern soldering lines. Key formulation choices preserve mechanical properties across thousands of cycles.
Machinability to precision: woven reinforcement and resin balance allow thin wall sections and small standoffs with minimal fraying — enabling pocket walls and fine tooling features that match complex PCB outlines.
ESD-friendly surface control: surface resistivity is tuned to support automated inspection and handling while avoiding conductive shorts — supplied in grades to match line requirements.
Flux robustness: resin chemistry resists halide-containing and other modern flux activators, which significantly extends usable pallet life in demanding production environments.
Typical density ~1.8–1.9 g/cm³.
Continuous use (process) temperature engineered for up to ~280°C.
Flexural strength and modulus tailored for fixture loads and thin-wall stability (industrial grades commonly specified in datasheets).
Surface resistivity: selectable antistatic range suitable for ESD control and optical inspection.
Low thermal conductivity to reduce heat transfer to sensitive components during soldering.
Available standard sheet sizes and custom thicknesses for CNC cutting and routing.
(The values above are intended for comparison and selection. Use the supplier’s current technical datasheet and run process validation tests on actual line profiles before final acceptance.)
Longer fixture service life: fewer pallet replacements and less downtime for changeovers, reducing total cost of ownership.
Tighter tolerances in production: pallets that keep fiducials, component leads and tooling pins accurately positioned over repeated cycles means higher first-pass yield.
Simplified logistics: selecting an ESD-capable base material removes extra handling steps and surface treatments in many lines.
Fenhar’s sheet is positioned to match the operating envelope and application focus of well-known commercial grades such as Röchling’s Durostone® and Ricocel® types; it can be considered where customers want an equivalent performance band with alternative sourcing, custom surface-resistivity grades, or tailored machining support.
Mixed-technology wave-solder pallets for boards that combine dense through-hole components with SMD clusters, where precise pocketing and minimal heat transfer are critical.
Inline carriers used across wave, AOI and functional test sequences — carriers that protect board flatness and fiducials through multiple process stations.
Pilot-run qualification carriers for lead-free profile validation — reusable fixtures used to log lifetime-to-failure and flux-compatibility during process characterization.
Use sharp carbide tooling and optimized feeds to avoid edge chipping; program toolpaths to clear fibers and reduce delamination.
When designing pockets and walls, maintain recommended radii and minimum wall thickness per the grade’s machining guide (some grades can reliably hold walls near 0.50 mm under controlled machining).
When ESD behavior is critical, request the exact surface resistivity class and test coupons for in-line verification.
Fenhar supplies standard panel sizes and offers custom cutting, CNC routing and surface grading services to match production needs. For pilot orders, request sample carriers and a machining support pack (recommended feeds/speeds, recommended tooling, and a flux-compatibility checklist).
This PCB Antistatic (ESD) Wave Solder Pallet Material was developed with real assembly-line demands in mind: repeatable tolerances, chemical resilience and ESD control. For quotations, sample requests or a milling test of your first pallet design, contact Fenhar Material’s technical sales team and provide a CAD outline and the process profile you run (solder temperatures and typical flux types).
